Preparation method for using epoxy resin for microwave to package sheet mica capacitor

The invention discloses a preparation method for using epoxy resin for microwave to package a sheet mica capacitor and relates to a preparation method of the sheet mica capacitor, which aims at solving the defects that the package of the existing sheet mica capacitor and the preparation of the terminal electrode have high material cost, large energy consumption and complex technique; the preparation method comprises the following steps of: a. printing a silver paste layer at the two surfaces of the large mica in a staggered manner and sintering the silver paste layer into a silver inner electrode; b. printing glass paste at the no-silver of one surface of the mica with the two silver-plated surfaces, assembling in a staggered and laminating mode after being dried, assembling acid-resistant glass as protecting pieces on the two surfaces of the outer side, and sintering the glass protecting pieces and multilayer mica pieces into a whole; c. cutting the no-silver part of the large mica piece into a plurality of