Semiconductor device, its manufacturing method and optical pickup module

A semiconductor device in which a lid for protecting a semiconductor element or a transparent member can be secured stably while reducing the overall size. A semiconductor element (10) is mounted on the substrate portion (60) of a package (50) having the rectangular substrate portion (60), and ribs...

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Bibliographische Detailangaben
Hauptverfasser: NANO MASANORI, FUKUDA TOSHIYUKI, ISHIDA HIROYUKI, MORIBE SHOZO, YOSHIKAWA NORIYUKI, KOYASHIKI JUNYA, UDATSU HIROKI
Format: Patent
Sprache:chi ; eng
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