Semiconductor device, its manufacturing method and optical pickup module

A semiconductor device in which a lid for protecting a semiconductor element or a transparent member can be secured stably while reducing the overall size. A semiconductor element (10) is mounted on the substrate portion (60) of a package (50) having the rectangular substrate portion (60), and ribs (70, 70) provided on a pair of opposing outer edges of the substrate portion (60), and the electrode pad (20) of the semiconductor element (10) is connected with a connection electrode (75) provided on the upper surface of rib (70b) by a metal thin wire (22). Spacers (80, 80) are provided on the upper surface of rib (70b) on the outside of the connection electrode (75), and a transparent lid (90) is provided on the upper surface of the spacers (80, 80) to cover the entire surface of the package (50). Height of the spacers (80, 80) is larger than the diameter of the metal thin wire (22).