Processing technique for lead of touch screen

The invention relates to a processing technique for an Mo-Al-Mo lead of a touch screen, which comprises the following steps: sputtering a bottom layer Mo layer, a middle layer Al layer, and a surface layer Mo layer in turn on a glass substrate, wherein reaction gas N2 is introduced in a sputtering s...

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Bibliographische Detailangaben
Hauptverfasser:	XU DONGDONG, FU ZHIMIN, MAO LILIANG, HUANG YUKUN, FANG GANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPUTING COUNTING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PHYSICS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The invention relates to a processing technique for an Mo-Al-Mo lead of a touch screen, which comprises the following steps: sputtering a bottom layer Mo layer, a middle layer Al layer, and a surface layer Mo layer in turn on a glass substrate, wherein reaction gas N2 is introduced in a sputtering system when the surface layer Mo layer is sputtered; and etching the sputtered Mo-Al-Mo layers into the Mo-Al-Mo lead by adopting etching liquid according to a preset pattern. The processing technique provided by the invention is different from the conventional method which adopts special etching liquid to etch a slope-shaped structure on a lead section, has simple technical process, is easy to control, has high efficiency and reduces the cost.