Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device
A semiconductor device includes a semiconductor substrate on which an electrode and a Cu bump are stacked. On the electrode and the Cu bump, a metal bump layer is provided. The metal bump layer comprises (i) a solder layer via which the semiconductor device is bonded and electrically connected to th...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | A semiconductor device includes a semiconductor substrate on which an electrode and a Cu bump are stacked. On the electrode and the Cu bump, a metal bump layer is provided. The metal bump layer comprises (i) a solder layer via which the semiconductor device is bonded and electrically connected to the mounting substrate by metal bonding and (ii) a Cu layer. A intermetallic compound can be formed by interdiffusion of the Cu layer and the solder layer. |
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