Lead-free soft solder having improved properties at elevated temperatures

Disclosed is a lead-free soft solder based on an Sn-In-Ag solder alloy. The soft solder contains 88 to 98.5 percent by weight of Sn, 1 to 10 percent by weight of In, 0.5 to 3.5 percent by weight of Ag, and 0 to 1 percent by weight of Cu, and is doped with a crystallization modifier, particularly a m...

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Bibliographische Detailangaben
Hauptverfasser:	TRODLER JOERG, KRAEMER WINFRIED
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Disclosed is a lead-free soft solder based on an Sn-In-Ag solder alloy. The soft solder contains 88 to 98.5 percent by weight of Sn, 1 to 10 percent by weight of In, 0.5 to 3.5 percent by weight of Ag, and 0 to 1 percent by weight of Cu, and is doped with a crystallization modifier, particularly a maximum of 100 ppm of neodymium. The soft solder further contains 0 to 3 percent of GA, Sb, Bi and has a fusion temperature exceeding 210 DEG C, high resistance to fatigue at elevated temperatures, and little growth of intermetallic phases. The disclosed alloy can be used for soldering electronic components in wafer bumping technology.