A metal/ polymer composite particle and method of preparing the same
The present invention relates to a metal/ polymer composite particle and method of preparing the same, and the outer layer (lamella) is metal and the inner layer (nucleus) is organic polymer. More specifically, the lamella is conductive metal layer and the metal includes but not limited to Cu, Ag, A...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present invention relates to a metal/ polymer composite particle and method of preparing the same, and the outer layer (lamella) is metal and the inner layer (nucleus) is organic polymer. More specifically, the lamella is conductive metal layer and the metal includes but not limited to Cu, Ag, Au and Pt etc. the organic polymer particles used as composite particle nucleus can be hollow polymerballs, sphere wall of the organic polymer balls has a certain intensity and the surface contains a large amount of reactivity groups, and metal/polymer composite particles can be obtained on deposition metal layer of the surface after amination modification. The metal/polymer composite particles can be used for preparing conductive materials and conductive particles used as conductive adhesive etc. |
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