Energy-efficient semiconductor plastic package die

The invention discloses an energy-efficient semiconductor plastic package die, wherein the upper central casting plate of the upper die box (8) and the lower central casting plate of the lower die box(9) form a closed cavity; the upper die box (8) and the lower die box (9) are provided with gel passages (24) which are hollow pipelines connected with the flow passage (25); the gel passages (24) are connected with an integrated component cavity (26) via the flow passage (25); the casting head (4) is connected with the cavity; the liquid resin of the feeding cylinder (31) is infused via the flowpassage and the flow passage (25) by the casting head. The invention overcomes the disadvantages of long casting process of current technology, bad air tightness of plastic-casting products, and complication of insert and mandril exchange. The invention provides a semiconductor plastic package die with large density, convenient disassembly and little plastic package material waste, saves 15%-30%resin, and improves utiliza