Sensing type semiconductor package and production method thereof

The invention discloses a sensing type semiconductor packaging piece and a manufacturing method thereof and mainly provides a substrate. A sensing chip with a sensing area is connected with and placed on the substrate, the sensing chip and the substrate are electrically connected by welding wires, an adhesion layer is formed on a light penetrating body, and has an opening corresponding to the sensing area so as to connect the light penetrating body on the substrate via the adhesion layer for heating, thus leading the adhesion layer to present a molten condition when being connected with the substrate to cover the circumference of the sensing chip and welding wires; in addition, the sensing area is exposed so as to lead the light penetrating body to close over the sensing area to form the light, thin and short sensing type semiconductor packaging piece without dam structure, thus reducing the manufacturing cost. Moreover, with the adhesion layer covering the welding wires, the rupture problems of the welding w