Grinding method of wafer control slice

The invention provides a method for grinding control wafers, which comprises that: the thickness of a grinding clamp is made to be slightly smaller than that of two control wafers, and then the two control wafers are stacked in a mode of back to back so as to ensure that the surfaces to be ground of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TANG JINGJI, DAI WENJUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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