Grinding method of wafer control slice

The invention provides a method for grinding control wafers, which comprises that: the thickness of a grinding clamp is made to be slightly smaller than that of two control wafers, and then the two control wafers are stacked in a mode of back to back so as to ensure that the surfaces to be ground of the two control wafers are put into holes of the grinding clamp facing to a grinding upper disc and a grinding lower disc respectively; the grinding upper disc and the grinding lower disc are utilized to grind the surfaces to be ground of the two control wafers simultaneously; and at the same time, an absorption medium is adsorbed between the two control wafers so as to ensure that the two control wafers are adsorbed together tightly and avoid slide in the process of grinding. The method for grinding the control wafers can reduce the removed volume of silicon of the control wafers in the process of grinding effectively, increase the number of recycling times of the control wafers, improve the productivity of a gri