Non-contact type embedded body of electronic credential and method for producing the same
The invention provides a non-contact embedded body of an electronic certificate and a method for manufacturing the same. The embedded body comprises an upper protective layer, an upper connecting layer, a chip bearing bed, a lower connecting layer and a lower protective layer which are molten and co...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a non-contact embedded body of an electronic certificate and a method for manufacturing the same. The embedded body comprises an upper protective layer, an upper connecting layer, a chip bearing bed, a lower connecting layer and a lower protective layer which are molten and compounded from top to bottom in sequence. The materials of the upper protective layer and the lower protective layer are a flexible material suitable for combining the certificate binding process and the prior paperhanging adhesive. The materials of the upper protective layer and the lower protective layer are fiber materials with a textile structure, or non-woven fabric, or paper or cotton fabric. The materials of the connecting layers are macromolecular and thermoplastic elastic films. The invention also provides the method for manufacturing the non-contact embedded body of the electronic certificate. The method comprise: melting and compounding the upper protective layer, the upper connecting layer, the chip bear |
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