Radiating device

The invention relates to a heat radiator used for heat dissipation of electronic components, comprising a base plate, a top plate and a plurality of heat pipes, wherein, the top plate is arranged on the based plate and the heat pipes are clamped between the top plate and the base plate. The base pla...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LAI QIYUAN, ZHOU ZHIYONG, LAI ZHENTIAN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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