Radiating device

The invention relates to a heat radiator used for heat dissipation of electronic components, comprising a base plate, a top plate and a plurality of heat pipes, wherein, the top plate is arranged on the based plate and the heat pipes are clamped between the top plate and the base plate. The base plate comprises a plate body carrying the heat pipes and side walls extending upwards from the two opposite sides of the plate body; and a plurality of locating plates which are inserted in the top plate are arranged on the side walls. Compared with the prior art, the locating plates are arranged on the side walls of the base plate of the heat radiator, and the locating plates are clamped in the top plate for locating the top plate; therefore, the base plate can realize the locating function for the top plate without needing any locating jig, so as to well control the overall manufacturing cost of the heat radiator.