Internal memory module group and its heat radiating device

A memory module comprises a memory strip and a heat dissipating device arranged on the memory strip. The memory strip is provided with a left side surface and a right side surface; the heat dissipating device comprises a radiator and at least one heat pipe; the radiator comprises a base and a cover plate which is installed on the base and in contact with the right side surface of the memory strip; the base comprises a body part which is in contact with the left side surface of the memory strip, a support part which extend from the body and is in contact with the top side of the memory strip; the heat pipe comprises an evaporation section which is in contact with one of the body part and the cover plate, and a condensation section which is in contact with the support part.