An IC for a high frequency communication device with a minimal off chip components

The invention provides an IC for a high frequency communication device with minimal chip components and relates to a receiver module, a transmitter module, an inbound digital module, and a local oscillation generation module. The receiver module is operable to convert an inbound high frequency signal into a down converted inbound signal based on a received local oscillation independently of a protocol of the inbound high frequency signal. The inbound digital module is used to compensate the down converted inbound signal in accordance with a selected one of the first plurality of wireless communication protocols. The transmitter module is operable to convert a first outbound signal into a first up converted signal based on a transmit local oscillation when a first one of the first plurality of wireless communication protocols is active and to convert a second outbound signal into a second up converted signal based on the transmit local oscillation when a second one of the first plurality of wireless communicat