Method for manufacturing suspension micro electromechanical structure
The invention discloses a method for manufacturing a suspension micro electromechanical structure, which comprises the following steps: firstly, at least one insulation layer internally provided with a metal micro electromechanical structure is formed on the upper surface of a silicon fundus, the mi...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a method for manufacturing a suspension micro electromechanical structure, which comprises the following steps: firstly, at least one insulation layer internally provided with a metal micro electromechanical structure is formed on the upper surface of a silicon fundus, the micro electromechanical structure comprises at least one microstructure and at least one metal sacrifice structure which are independent with each other, and the metal sacrifice structure is internally provided with metal layers and metal bolt layers connecting the metal layers; secondly, at least one blocking layer is made on the upper surface of the insulation layer; thirdly, at least one etching blocking layer is made on the lower surface of the silicon fundus; fourthly, etching is carried outto the lower surface of the silicon fundus to form a space corresponding to the inner suspension microstructure of the micro electromechanical structure; and finally, etching is carried out to the metal sacrifice structure to |
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