Photo-curing resin composition, design of cured composition and printed circuit board
The invention provides an alkali developing type light-cured resin composition and a cured resin pattern and a printed board. The composition has high sensitivity for active energy ray, an exposure curability directly depicted by laser, and a developing ability, a finger touch dryness, a solder ther...
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| creator | ITO NOBUTO ARIMA YUKIO |
| description | The invention provides an alkali developing type light-cured resin composition and a cured resin pattern and a printed board. The composition has high sensitivity for active energy ray, an exposure curability directly depicted by laser, and a developing ability, a finger touch dryness, a solder thermal endurance, a chemical gold plating resistance, an alkali tolerance, and a PCT and PCBT resistance are excellent, thus the composition can be used as a solder resist. The alkali developing type light-cured resin composition comprises: (A) a carboxylic acid-containing photosensitive resin shown as a general formula (I), (B) a photopolymerization initator, (C) a compound with more than two olefinic unsaturated groups in one molecule, in the general formula (I), R is a hydrogen atom or a methyl, R is a straight-chain, branched chain or cyclic alkyl with 2-6 carbon atoms, and R is hydrogen atom or carboxylic acid ester residue. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN101430506A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN101430506A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN101430506A3</originalsourceid><addsrcrecordid>eNrjZAgNyMgvyddNLi3KzEtXKEotzsxTSM7PLcgvzizJzM_TUUgBCqXnKeSnKQDVpKYgSyok5qUoFAA1loDEM4uSSzNLFJLyE4tSeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoYGhibGBqYGZozExagAA5Dle</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Photo-curing resin composition, design of cured composition and printed circuit board</title><source>esp@cenet</source><creator>ITO NOBUTO ; ARIMA YUKIO</creator><creatorcontrib>ITO NOBUTO ; ARIMA YUKIO</creatorcontrib><description>The invention provides an alkali developing type light-cured resin composition and a cured resin pattern and a printed board. The composition has high sensitivity for active energy ray, an exposure curability directly depicted by laser, and a developing ability, a finger touch dryness, a solder thermal endurance, a chemical gold plating resistance, an alkali tolerance, and a PCT and PCBT resistance are excellent, thus the composition can be used as a solder resist. The alkali developing type light-cured resin composition comprises: (A) a carboxylic acid-containing photosensitive resin shown as a general formula (I), (B) a photopolymerization initator, (C) a compound with more than two olefinic unsaturated groups in one molecule, in the general formula (I), R is a hydrogen atom or a methyl, R is a straight-chain, branched chain or cyclic alkyl with 2-6 carbon atoms, and R is hydrogen atom or carboxylic acid ester residue.</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090513&DB=EPODOC&CC=CN&NR=101430506A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090513&DB=EPODOC&CC=CN&NR=101430506A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ITO NOBUTO</creatorcontrib><creatorcontrib>ARIMA YUKIO</creatorcontrib><title>Photo-curing resin composition, design of cured composition and printed circuit board</title><description>The invention provides an alkali developing type light-cured resin composition and a cured resin pattern and a printed board. The composition has high sensitivity for active energy ray, an exposure curability directly depicted by laser, and a developing ability, a finger touch dryness, a solder thermal endurance, a chemical gold plating resistance, an alkali tolerance, and a PCT and PCBT resistance are excellent, thus the composition can be used as a solder resist. The alkali developing type light-cured resin composition comprises: (A) a carboxylic acid-containing photosensitive resin shown as a general formula (I), (B) a photopolymerization initator, (C) a compound with more than two olefinic unsaturated groups in one molecule, in the general formula (I), R is a hydrogen atom or a methyl, R is a straight-chain, branched chain or cyclic alkyl with 2-6 carbon atoms, and R is hydrogen atom or carboxylic acid ester residue.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2009</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgNyMgvyddNLi3KzEtXKEotzsxTSM7PLcgvzizJzM_TUUgBCqXnKeSnKQDVpKYgSyok5qUoFAA1loDEM4uSSzNLFJLyE4tSeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoYGhibGBqYGZozExagAA5Dle</recordid><startdate>20090513</startdate><enddate>20090513</enddate><creator>ITO NOBUTO</creator><creator>ARIMA YUKIO</creator><scope>EVB</scope></search><sort><creationdate>20090513</creationdate><title>Photo-curing resin composition, design of cured composition and printed circuit board</title><author>ITO NOBUTO ; ARIMA YUKIO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN101430506A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2009</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>ITO NOBUTO</creatorcontrib><creatorcontrib>ARIMA YUKIO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ITO NOBUTO</au><au>ARIMA YUKIO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Photo-curing resin composition, design of cured composition and printed circuit board</title><date>2009-05-13</date><risdate>2009</risdate><abstract>The invention provides an alkali developing type light-cured resin composition and a cured resin pattern and a printed board. The composition has high sensitivity for active energy ray, an exposure curability directly depicted by laser, and a developing ability, a finger touch dryness, a solder thermal endurance, a chemical gold plating resistance, an alkali tolerance, and a PCT and PCBT resistance are excellent, thus the composition can be used as a solder resist. The alkali developing type light-cured resin composition comprises: (A) a carboxylic acid-containing photosensitive resin shown as a general formula (I), (B) a photopolymerization initator, (C) a compound with more than two olefinic unsaturated groups in one molecule, in the general formula (I), R is a hydrogen atom or a methyl, R is a straight-chain, branched chain or cyclic alkyl with 2-6 carbon atoms, and R is hydrogen atom or carboxylic acid ester residue.</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
| recordid | cdi_epo_espacenet_CN101430506A |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | Photo-curing resin composition, design of cured composition and printed circuit board |
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