Photo-curing resin composition, design of cured composition and printed circuit board
The invention provides an alkali developing type light-cured resin composition and a cured resin pattern and a printed board. The composition has high sensitivity for active energy ray, an exposure curability directly depicted by laser, and a developing ability, a finger touch dryness, a solder ther...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides an alkali developing type light-cured resin composition and a cured resin pattern and a printed board. The composition has high sensitivity for active energy ray, an exposure curability directly depicted by laser, and a developing ability, a finger touch dryness, a solder thermal endurance, a chemical gold plating resistance, an alkali tolerance, and a PCT and PCBT resistance are excellent, thus the composition can be used as a solder resist. The alkali developing type light-cured resin composition comprises: (A) a carboxylic acid-containing photosensitive resin shown as a general formula (I), (B) a photopolymerization initator, (C) a compound with more than two olefinic unsaturated groups in one molecule, in the general formula (I), R is a hydrogen atom or a methyl, R is a straight-chain, branched chain or cyclic alkyl with 2-6 carbon atoms, and R is hydrogen atom or carboxylic acid ester residue. |
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