Heat radiating device used for semiconductor power module

Heat radiating device used for semiconductor power module

The invention provides a heat sink which is equipped with a projection part of a plate-shaped part of a semiconductor power module at the lower part of a semiconductor chip. As the heat generated by the semiconductor chip is absorbed by the projection part of the plate-shaped part of the heat sink,...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ONU NAOTO, MIGATA FUMIAKI
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The invention provides a heat sink which is equipped with a projection part of a plate-shaped part of a semiconductor power module at the lower part of a semiconductor chip. As the heat generated by the semiconductor chip is absorbed by the projection part of the plate-shaped part of the heat sink, the temperature rise of the semiconductor chip is slowed, thus alleviating the thermal stress exerted on the semiconductor chip, and further alleviating the thermal stress exerted on the semiconductor chip of the semiconductor power module.