Printed plate component and method of processing the same

The invention relates to a circuit board, in particular to a high-power printed circuit board component with radiating function in a high-frequency high-power circuit and the technique for realizing connection of a power amplifier thereof. The printed board component comprises a first printed board,...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HUANG XIONGFEI, LI HONGCAI, LI JIHOU, WANG CHUANYU, ZHANG XIKUN, LI SONGLIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The invention relates to a circuit board, in particular to a high-power printed circuit board component with radiating function in a high-frequency high-power circuit and the technique for realizing connection of a power amplifier thereof. The printed board component comprises a first printed board, a second printed board, a power tube and a radiator. The second printed board is a printed board for the first printed board to connect the high-frequency high-power apparatus. The second printed board is welded and fixed to the first printed board by the surface-adhering welding end at the side terminal. The power tube penetrates the open windows of the first printed board and the second printed board so as to be connected with the radiator. The pin of the power tube is welded to the second printed board. And the radiator is connected with the lower surface of the first printed board.