A method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate

The present application relates to a method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate, to a pattern created by such method and to uses of such pattern.

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Bibliographische Detailangaben
Hauptverfasser:	OFFENHAUESSER ANDREAS, WESSELS JURINA, YASUDA AKIO, RIEDEL MARC, KARIPIDOU ZOI, MAYER DIRK, SCHWAAB DANIEL, SCHREIBER AKOS
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	The present application relates to a method of applying a pattern of metal, metal oxide and/or semiconductor material on a substrate, to a pattern created by such method and to uses of such pattern.