Wire bonding system utilizing multiple positioning tables

The present invention provides a wire bonding apparatus and method, in which a first and a second positioning platforms separated with each other, are provided for mounting electronic devices to be wire bonded; a bonding tool is provided at a bonding position for bonding the electronic devices in the first and the second positioning platform; a first and second loading/unloading positions, are provided for loading electronic devices to or unloading electronic devices from the positioning tables; The first and second positioning tables are operative to move independently of each other, such that the first positioning table is movable between the first loading/unloading position and the bonding position and the second positioning table is movable between the second loading/unloading position and the bonding position.