Copper interconnection for fabricating flat-panel display

A method of depositing a copper interconnection layer on a substrate for use in a flat panel display interconnection system, comprising the steps of : a) Coating said substrate with a photoresist layer; b) Patterning said photoresist layer to obtain a patterned photoresist substrate comprising at le...

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Bibliographische Detailangaben

Hauptverfasser:	CHEN SHYUANFANG, NASU AKINOBU, CHEN YITSUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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