Copper interconnection for fabricating flat-panel display

A method of depositing a copper interconnection layer on a substrate for use in a flat panel display interconnection system, comprising the steps of : a) Coating said substrate with a photoresist layer; b) Patterning said photoresist layer to obtain a patterned photoresist substrate comprising at least one trench patterned into said photoresist layer,- c) Providing a first catalysation layer onto the patterned photoresist substrate; d) Providing an electroless plated layer of an insulation layer deposited onto said first catalysation layer,- e) Removing the successively superimposed photoresist layer, catalysation layer and insulation layer except in the at least one trench, to obtain a pattern of the first catalysation layer with an insulation layer deposited thereon.