Copper interconnection for fabricating flat-panel display
A method of depositing a copper interconnection layer on a substrate for use in a flat panel display interconnection system, comprising the steps of : a) Coating said substrate with a photoresist layer; b) Patterning said photoresist layer to obtain a patterned photoresist substrate comprising at le...
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| creator | CHEN SHYUANFANG NASU AKINOBU CHEN YITSUNG |
| description | A method of depositing a copper interconnection layer on a substrate for use in a flat panel display interconnection system, comprising the steps of : a) Coating said substrate with a photoresist layer; b) Patterning said photoresist layer to obtain a patterned photoresist substrate comprising at least one trench patterned into said photoresist layer,- c) Providing a first catalysation layer onto the patterned photoresist substrate; d) Providing an electroless plated layer of an insulation layer deposited onto said first catalysation layer,- e) Removing the successively superimposed photoresist layer, catalysation layer and insulation layer except in the at least one trench, to obtain a pattern of the first catalysation layer with an insulation layer deposited thereon. |
| format | Patent |
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b) Patterning said photoresist layer to obtain a patterned photoresist substrate comprising at least one trench patterned into said photoresist layer,- c) Providing a first catalysation layer onto the patterned photoresist substrate; d) Providing an electroless plated layer of an insulation layer deposited onto said first catalysation layer,- e) Removing the successively superimposed photoresist layer, catalysation layer and insulation layer except in the at least one trench, to obtain a pattern of the first catalysation layer with an insulation layer deposited thereon.</description><language>chi ; eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2009</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090304&DB=EPODOC&CC=CN&NR=101379608A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20090304&DB=EPODOC&CC=CN&NR=101379608A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN SHYUANFANG</creatorcontrib><creatorcontrib>NASU AKINOBU</creatorcontrib><creatorcontrib>CHEN YITSUNG</creatorcontrib><title>Copper interconnection for fabricating flat-panel display</title><description>A method of depositing a copper interconnection layer on a substrate for use in a flat panel display interconnection system, comprising the steps of : a) Coating said substrate with a photoresist layer; 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| language | chi ; eng |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES |
| title | Copper interconnection for fabricating flat-panel display |
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