Test construction and test method
The invention discloses a test structure and a test method for a wafer layer, wherein, a heating layer arranged in a wafer is used for directly heating a structure to be tested which is disposed above or beside the heating layer; and after being electrified, the heating layer generates heat. Therefo...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | The invention discloses a test structure and a test method for a wafer layer, wherein, a heating layer arranged in a wafer is used for directly heating a structure to be tested which is disposed above or beside the heating layer; and after being electrified, the heating layer generates heat. Therefore, the heating of the heating layer and the electric input of the structure to be tested are controlled separately without mutual influence. |
|---|