Method and apparatus for fixing use (by) colloid
The invention relates to a fixing method for using colloids. The fixing method comprises the following steps: a first base plate is provided with at least one first connecting pad; a second base plate is arranged corresponding to the first base plate and is provided with at least one second connecti...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a fixing method for using colloids. The fixing method comprises the following steps: a first base plate is provided with at least one first connecting pad; a second base plate is arranged corresponding to the first base plate and is provided with at least one second connecting pad arranged corresponding to the first connecting pad; a first insulating film is formed on the second base plate and covers the second base plate; a conducting adhesive provided with a plurality of conducting particles is arranged between the first base plate and the second base plate; and the first base plate and the second base plate are pressed to allow part of the conducting particles to pass through the first insulating film and the first connecting pad to be electrically connected with the second connecting pad through the conducting particles. The invention also discloses a fixing device for using the colloids. |
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