Substrate processing method and device manufacture method

The present invention disclose a substrate processing method of a substrate provided with an anti-reflective coating which extends to or beyond a peripheral edge of the substrate. The method includes removing a portion of the anti-reflective coating adjacent to and around a periphery of the substrat...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WONG PATRICK, GEHOEL VAN ANSEM WENDY FRANSIS, WANG SUPING, MAAS RUDOLF ADRIANUS JOANNES
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention disclose a substrate processing method of a substrate provided with an anti-reflective coating which extends to or beyond a peripheral edge of the substrate. The method includes removing a portion of the anti-reflective coating adjacent to and around a periphery of the substrate using a back-side removal process, depositing a layer of radiation sensitive material onto the anti-reflective coating, depositing a top-coat layer onto the layer of radiation sensitive material, and simultaneously removing a portion of the layer of radiation sensitive material and a portion of the top-coat layer from around an area adjacent to the periphery of the substrate using a top-side removal process.