Grinding head

The present invention discloses a grinding head, which is applicable to the chemical mechanical grinding technique. The grinding head comprises an inner ring part and an outer ring part. The outer ring part has an annular structure and is connected with the inner ring part. The inner ring part is in...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YANG DETAI, LIU GUORU, LI YUNHAI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention discloses a grinding head, which is applicable to the chemical mechanical grinding technique. The grinding head comprises an inner ring part and an outer ring part. The outer ring part has an annular structure and is connected with the inner ring part. The inner ring part is integrated with the outer ring part. Moreover, a level difference exists between the surface of the outer ring part and the surface of the inner ring part, so that the surface of the outer ring part is higher than the surface of the inner ring part. The grinding head can increase the grinding rate of the edge of the grinding head without consumables in order to improve the uniformity of the grinding rate, and fixed back pressure can be applied on the grinding head in order to obtain better grinding uniformity.