Printed circuit board and manufacturing method thereof

The invention relates to a printed circuit board and a manufacturing method thereof. A coil element with enough inductance is formed inside the printed circuit board, thereby realizing two layers of minitype and high density printed circuit boards for greatly reducing the section of the element, and...

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Bibliographische Detailangaben
1. Verfasser:	ISHIBARA KEINOBE
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention relates to a printed circuit board and a manufacturing method thereof. A coil element with enough inductance is formed inside the printed circuit board, thereby realizing two layers of minitype and high density printed circuit boards for greatly reducing the section of the element, and a method for manufacturing the printed circuit board in low cost and stably, characterized in that, the coil has a twist wiring pattern(7) and a conduction magnet part (30) arranged on the center of the wiring pattern and electrically connected therewith, and electrical connection between the layers is processed through the conduction magnet part.