Surface-mounting electronic component

The invention provides a surface-mounting type electronic element obtained by molding liquid crystal polymer composite. The composite contains 100 parts by weight of an aromatic liquid crystal polymer with the crystal fusion temperature of 310-410 degrees centigrade, 5-100 parts by weight of a glass...

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Hauptverfasser: KOMETANI KIICHI, SAITO NAOSHI
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creator KOMETANI KIICHI
SAITO NAOSHI
description The invention provides a surface-mounting type electronic element obtained by molding liquid crystal polymer composite. The composite contains 100 parts by weight of an aromatic liquid crystal polymer with the crystal fusion temperature of 310-410 degrees centigrade, 5-100 parts by weight of a glass fiber with 4-8 um number average length and 100-200um number average length, wherein the LCP composite has the load deflection temperature (DTUL) of 280-360 degrees centigrade.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PRINTED CIRCUITS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
title Surface-mounting electronic component
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