Surface-mounting electronic component

The invention provides a surface-mounting type electronic element obtained by molding liquid crystal polymer composite. The composite contains 100 parts by weight of an aromatic liquid crystal polymer with the crystal fusion temperature of 310-410 degrees centigrade, 5-100 parts by weight of a glass...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KOMETANI KIICHI, SAITO NAOSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The invention provides a surface-mounting type electronic element obtained by molding liquid crystal polymer composite. The composite contains 100 parts by weight of an aromatic liquid crystal polymer with the crystal fusion temperature of 310-410 degrees centigrade, 5-100 parts by weight of a glass fiber with 4-8 um number average length and 100-200um number average length, wherein the LCP composite has the load deflection temperature (DTUL) of 280-360 degrees centigrade.