Sensing type semiconductor device and its manufacture

The invention discloses a sensing type semiconductor device and a method for making the same. The sensing type semiconductor device is obtained through the method and comprises a sensing chip, a first conductive circuit, a second conductive circuit, a metal layer and an illuminator, wherein the sens...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HUANG JIANPING, ZHAN CHANGYUE, XIAO CHENGXU, HUANG ZHIMING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a sensing type semiconductor device and a method for making the same. The sensing type semiconductor device is obtained through the method and comprises a sensing chip, a first conductive circuit, a second conductive circuit, a metal layer and an illuminator, wherein the sensing chip has an active surface and a non-active surface which are opposite to each other, and the active surface is formed into a sensing area and a plurality of welding pads; the first conductive circuit is formed on the edge of the sensing chip and is in electrical connection with the welding pads; the second conductive circuit is formed on the edge of the non-active surface of the sensing chip; the metal layer is formed on the side of the sensing chip so as to be electrically connected with the first conductive circuit and the second conductive circuit; and the illuminator is connected with the active surface of the sensing chip to cover the sensing area. The sensing type semiconductor device can prevent the pri