Method for manufacturing electrode substrate with auxiliary wiring

The present invention provides a manufacturing method of an electrode substrate, in order to effectively implement a layout design of a laminating body and a transparent conductive film for forming assistant wiring, implement layout design on the transparent conductive film through optical etching m...

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1. Verfasser: TAKEHIKO HIRUMA
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present invention provides a manufacturing method of an electrode substrate, in order to effectively implement a layout design of a laminating body and a transparent conductive film for forming assistant wiring, implement layout design on the transparent conductive film through optical etching method, inhibit the erosion to the assistant wiring of etching reagent for the transparent conductive film, and obtain the assistant wiring and the transparent band assistant wiring. The manufacturing method of the electrode substrate of the band assistant wiring is to implement layout design by plane shape on the transparent conductive film through optical etching method to the substrate of the assistant wiring with the transparent conductive film and pattern, wherein the assistant wiring includes conductor layer and coverage layer taking Al or Al alloy as main component orderly from the substrate side, the assistant wiring which is not covered by the photosensitive resist exposes 4 mum below in the width direction