Substrate structure

Provided is a substrate structure, which permits a resin section covering a plurality of electronic components together to have a shielding characteristic and a heat dissipating characteristic, and is applicable to reduction in sizes, thickness and the number of components. The substrate structure (...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TOMEKAWA SATORU, KUBOTA KOSUKE, ONO MASAHIRO, HAYAKAWA HARUO, MATSUKI TAKEO, NAKANISHI KIYOSHI, SHINCHI KAZUHIRO, NISHIMURA EIJI, KONISHI KAZUHIRO, KATAGIRI ATSUSHI, UDA YOSIHIRO, YAMAGUCHI SEIJI, KOTANI MOTOHISA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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