Substrate structure

Provided is a substrate structure, which permits a resin section covering a plurality of electronic components together to have a shielding characteristic and a heat dissipating characteristic, and is applicable to reduction in sizes, thickness and the number of components. The substrate structure (20) is provided with a substrate (21); a plurality of electronic components (22) mounted along the substrate (21); and a resin section (25) which covers each electronic component (22) and adheres to the substrate (21). In the substrate structure (20), the resins section (25) is provided with a reinforcing heat dissipating layer (26) which covers each electronic component (22) and has a heat conducting characteristic and a reinforcing characteristic; and a shielding layer (27) for covering the reinforcing heat dissipating layer (26). The surface (28) of the shielding layer (27) is formed in a prescribed shape corresponding to a surface shape of a display device (30) adjacent to the resin section (25).