Stannum-copper binary alloy leadless solder paste

The invention relates to a lead-free soldering paste. Alloy welding powder is made to the soldering paste through mixing bismuth-tin binary eutectic alloy welding powder Bi48Sn42 and tin-copper binary eutectic alloy welding powder which are in the mixture ratio of 20 to 60:80 to 40 and adding scalin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HUANG JINSONG, MO LI, TAN ZHOUCHENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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