Stannum-copper binary alloy leadless solder paste

The invention relates to a lead-free soldering paste. Alloy welding powder is made to the soldering paste through mixing bismuth-tin binary eutectic alloy welding powder Bi48Sn42 and tin-copper binary eutectic alloy welding powder which are in the mixture ratio of 20 to 60:80 to 40 and adding scalin...

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Bibliographische Detailangaben
Hauptverfasser:	HUANG JINSONG, MO LI, TAN ZHOUCHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention relates to a lead-free soldering paste. Alloy welding powder is made to the soldering paste through mixing bismuth-tin binary eutectic alloy welding powder Bi48Sn42 and tin-copper binary eutectic alloy welding powder which are in the mixture ratio of 20 to 60:80 to 40 and adding scaling powder. The alloy welding powder is made up of the bismuth-tin binary eutectic alloy welding powder Bi48Sn42 which takes the mass percent of 80 to 90 percent, and the tin-copper binary eutectic alloy welding powder takes the mass percent of 10 to 20 percent. The lead-free soldering paste keeps the peak value temperature between 210 to 220 DEG C in reflow soldering process, greatly reducing the peak value temperature and the possibility for damaging a breadboard and an element device.