Resin composition, sheet-like formed body, prepreg, cured body, laminate, and multilayer laminate

Disclosed is a resin composition containing an epoxy resin and an inorganic filler, particularly a resin composition which is improved in adhesion or cohesion between a cured product thereof and a second layer when the second layer is formed on the surface of the cured product. Also disclosed are a...

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Bibliographische Detailangaben
Hauptverfasser:	KOBAYASHI TAKAYUKI, GOTO NOBUHIRO, HEISHI MASARU, KOUYANAGI HIROSHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	Disclosed is a resin composition containing an epoxy resin and an inorganic filler, particularly a resin composition which is improved in adhesion or cohesion between a cured product thereof and a second layer when the second layer is formed on the surface of the cured product. Also disclosed are a prepreg using such a resin composition, a cured body, a sheet-like formed body, a laminate and a multilayer laminate. Specifically disclosed is a resin composition containing an epoxy resin, a curing agent for epoxy resins, and a silica which is treated with an imidazole silane and has an average particle diameter of not more than 5 [mu]m. This resin composition contains 0.1-80 parts by weight of the silica per 100 parts by weight of a mixture composed of the epoxy resin and the curing agent for epoxy resins.