Hot-dip galvanizing with electroless ni pre-plating method for controlling thickness of silicon-containing active steel plating

The invention discloses an electroless nickel pre-plating and hot post-galvanizing method for controlling the coating thickness of the silicon-containing reactive steel, which means first performing electroless nickel plating and then hot dip galvanizing on a silicon-containing reactive steel part....

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Hauptverfasser: CHE CHUNSHAN, XU QIAOYU, LU JINTANG, KONG GANG
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses an electroless nickel pre-plating and hot post-galvanizing method for controlling the coating thickness of the silicon-containing reactive steel, which means first performing electroless nickel plating and then hot dip galvanizing on a silicon-containing reactive steel part. The electroless nickel pre-plating and hot post-galvanizing method comprises the following processes: (1) doing pretreatment on the surface of the silicon-containing reactive steel part before electroless nickel plating; (2) carry out electroless nickel plating on the surface of the silicon-containing reactive steel part, wherein, the nickel salt used is NiSO4 x 6H2 O, the reducing agent is NaH2PO2 x H2O, and the complexing agent is C6H5Na3O7 x 2H2O; (3) after drying the silicon-containing reactive steel part undergoing electroless nickel plating, conducting hot dip galvanizing on the reactive steel part. The electroless nickel pre-plating and hot post-galvanizing method for controlling the coating thickness of the