Hot-dip galvanizing with electroless ni pre-plating method for controlling thickness of silicon-containing active steel plating
The invention discloses an electroless nickel pre-plating and hot post-galvanizing method for controlling the coating thickness of the silicon-containing reactive steel, which means first performing electroless nickel plating and then hot dip galvanizing on a silicon-containing reactive steel part....
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The invention discloses an electroless nickel pre-plating and hot post-galvanizing method for controlling the coating thickness of the silicon-containing reactive steel, which means first performing electroless nickel plating and then hot dip galvanizing on a silicon-containing reactive steel part. The electroless nickel pre-plating and hot post-galvanizing method comprises the following processes: (1) doing pretreatment on the surface of the silicon-containing reactive steel part before electroless nickel plating; (2) carry out electroless nickel plating on the surface of the silicon-containing reactive steel part, wherein, the nickel salt used is NiSO4 x 6H2 O, the reducing agent is NaH2PO2 x H2O, and the complexing agent is C6H5Na3O7 x 2H2O; (3) after drying the silicon-containing reactive steel part undergoing electroless nickel plating, conducting hot dip galvanizing on the reactive steel part. The electroless nickel pre-plating and hot post-galvanizing method for controlling the coating thickness of the |
---|