Phase-change heat conductive material and preparation method thereof
The invention discloses a phase-change heat conducting material and the preparation method, mainly comprising the silicone 10 to 40 wt percent, the ethylene propylene diene rubber 2 to 20 wt percent, the heat conducting powder 40 to 70 wt percent, the paraffin 5 to 25 wt percent, the tackifier 5 to...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a phase-change heat conducting material and the preparation method, mainly comprising the silicone 10 to 40 wt percent, the ethylene propylene diene rubber 2 to 20 wt percent, the heat conducting powder 40 to 70 wt percent, the paraffin 5 to 25 wt percent, the tackifier 5 to 35 wt percent and the resin acceptor 0.1 to 1.5 wt percent. The phase-change heat conducting material can be coated on the copper foil, the aluminum foil, the polyethylene naphthalatc film or the polyimide film in solution state in order to increasing the strength. The dissolved with the mixed refrigerant is solid in ambient temperature, so can be conveniently fixed between the radiator and the electronic device, GPU and CPU. When the temperature of the device is up to 40 to 70 degree C, the dissolved with the mixed refrigerant starts to soften and flow, so can fill with the air gap between the interfaces well, reduce the thermal resistance and accelerate the heat transference. The phase-change heat conducting mate |
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