Electronic component built-in substrate and method for manufacturing the same

It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two boards 10 and 20 . An electrode 34 of the electronic component 30 is electrically connected to at least one of the board 10 . Also, the boards 10 and 20 ar...

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Bibliographische Detailangaben
Hauptverfasser:	YOSHINO YUYA, KAJIKI ATSUNORI, YAMANISHI NORIO, TSUBOTA TAKASHI, INOUE AKINOBU, AKAIKE SADAKAZU
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	It is an electronic component built-in substrate 100 configured as follows. That is, an electronic component 30 is provided between at least two boards 10 and 20 . An electrode 34 of the electronic component 30 is electrically connected to at least one of the board 10 . Also, the boards 10 and 20 are electrically connected to each other. Additionally, the gap between the boards 10 and 20 is sealed with a resin. The electronic component built-in substrate 100 is featured in that a solder ball 40 for electrically connecting the boards 10 and 20 to each other is provided on a surface of the electronic component 30 , which faces the other board 20.