Circuit board structure and its making method

The invention relates to a structure of a circuit wafer and a making method thereof, mainly providing a surface which has at least a base body of a first circuit layer; a dielectric layer is formed on the surface of the base body, and a plurality of openings of a first and a second types are formed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAN YALUN, XU SHIBIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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