Circuit board structure and its making method

The invention relates to a structure of a circuit wafer and a making method thereof, mainly providing a surface which has at least a base body of a first circuit layer; a dielectric layer is formed on the surface of the base body, and a plurality of openings of a first and a second types are formed in the dielectric layer, wherein the openings of the second type are used for exposing an electrical connection pad of the first circuit layer; then a metal layer is formed on the surface of the dielectric layer and in the openings of the first and second types; and the metal layer on the surface of the dielectric layer is removed to form a second circuit layer in the opening of the fist type of the dielectric layer; then electricity is formed in the openings of the second type to connect with the structure of electric conduction in the first circuit layer, thus strengthening adhesion between the circuit and the dielectric layer and increasing the ability of making thin circuit in the circuit wafer.