Inductance measuring encapsulation part and its making method

The invention relates to a sensing encapsulation part and a manufacturing method thereof. A sensing chip is arranged on and communicated to a load bearing part of a chip through a welding line to provide a light transmission body to be connected with the sensing chip with an interval of an adhesive layer, wherein, the size of a starting plane of the light transmission body is larger than the predetermined completion size of the sensing encapsulation part. A glue seal layer is formed on the load bearing part of the chip again to coat the sensing chip and the welding line and expose the upper surface of the light transmission body. Later, the cutting is carried out along the predetermined completion plane size of the sensing encapsulation part, thereby forming the sensing encapsulation part, the size of which is the same with the light transmission body. Furthermore, the contact area of the light transmission body and the glue seal layer is increased to strengthen the conjunction of the light transmission body.