Sensing type packaging member and its manufacturing method

The invention provides a sensing package and a preparation method of the same. A baseplate is connected with a sensing wafer which is in electric connection with the baseplate by a wire solder, the sensing wafer is connected with a non-light tight body, one surface of the non-light tight body is provided with a covering layer, the other surface of the non-light tight body is provided with a sticking layer; next, the manufacturing method of moulded package is done to directly form a package colloid for wrapping the non-light tight body; in the following, the covering layer and the package colloid wrapped on the covering layer can be removed at the same time by adopting the fact that the connectivity of the covering layer and the package colloid is greater than that of the covering layer and the non-light tight body to expose the non-light tight body for light going through the non-light tight body and retrieved by the sensing wafer, thereby avoiding using the prior arresting structure and providing a sensing p