Semiconductor package structure and method of manufacture

In one embodiment, a semiconductor package includes a lead frame having a lead portion and pad portion that are offset with respect to each other. The lead portion includes a deep formed impression. An up-bent portion connects the lead portion to the pad portion.

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Bibliographische Detailangaben
Hauptverfasser:	QUAH GUAN KENG, TAN HOU BOON, PAN QIANG HUA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	In one embodiment, a semiconductor package includes a lead frame having a lead portion and pad portion that are offset with respect to each other. The lead portion includes a deep formed impression. An up-bent portion connects the lead portion to the pad portion.