Burn-in sockets for BGA IC devices having an integrated slider with full ball grid compatibility

A slider 24 that integrates adaptor alignment and anti-stick features is shown for use in a socket for mounting BGA type IC devices for burn-in tests. Slider 24 has a top wall surface 14 b formed with a plurality of apertures in a grid array defined by intersecting ribs 14 e, 14 f. A plurality of wall extension portions 14 h are formed extending upwardly from portions of x-direction ribs that serve as fine alignment features with an IC device 2 adapted to be placed on the flat top end surface of the wall extension portions between rows of IC device solder ball terminals 2 a. Anti-stick fingers 24 c extend in the x-direction from wall extension portions 24 b along a y-direction rib defining the outer limit of the first column 14 s of apertures of the main grid. A concave surface 24 d is formed in each finger facing wall portions 24 b and the height of wall portions 24 b is limited to a location below the position of solder balls of an IC device mounted in the socket to provide clearance for a mechanical suppor