Process for measuring non-metal plate thickness

The present invention discloses a method for measuring the thickness of a non-metal plate, and the method is applied to the non-damage measurement of the non-metal plate in a civil engineering structure field or other fields. The thickness measuring principle of the present invention is based on a s...

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Bibliographische Detailangaben
Hauptverfasser: SUN GANGZHU, WANG WENQIU, XU SONGTAO, CUI YANQIU, PU CUNTING, CHEN GUANGQING, TANG JINXIANG, YANG JING, KAN YUEPENG, WANG JI, WANG LIGUANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The present invention discloses a method for measuring the thickness of a non-metal plate, and the method is applied to the non-damage measurement of the non-metal plate in a civil engineering structure field or other fields. The thickness measuring principle of the present invention is based on a spatial alternating electromagnetic field, the spatial magnetic field intensity (denoted with the induced voltage U of the coil of the point) at a certain point is monotonically attenuated following the increase of the distance H apart from the point, a numerical table to attribute the correlation of the induced voltage U and the distance H is established. When being tested, a transmitting coil produces the alternating magnetic field on one side of the non-metal plate, a receiving coil receives the signal of the alternating magnetic field on the other side of the non-metal plate, the signal of the alternating magnetic field is switched into the voltage signal U, the corresponding H value in the labeled array table i